Microchip ATTINY1617-MZT-VAO: A Comprehensive Datasheet and Application Overview

Release date:2026-01-24 Number of clicks:129

Microchip ATTINY1617-MZT-VAO: A Comprehensive Datasheet and Application Overview

The relentless drive towards smarter, more efficient, and smaller electronic systems has elevated the importance of capable microcontrollers (MCUs). At the forefront of this movement for space-constrained and power-sensitive applications is the ATTINY1617-MZT-VAO from Microchip Technology. This MCU, part of the modern ATtiny series, packs a significant punch with its enhanced core and rich peripheral set, making it an ideal choice for a vast array of embedded designs.

Core Architecture and Performance

At the heart of the ATTINY1617 lies the high-performance 8-bit AVR® processor with a hardware multiplier, running at up to 20 MHz. This core is a substantial upgrade over older AVR architectures, offering improved code density and execution speed. It operates within a wide voltage range (1.8V - 5.5V), making it perfectly suited for both battery-powered and line-operated devices. The core is supported by 16 KB of Flash memory, 2 KB of SRAM, and 128 bytes of EEPROM, providing ample space for application code, data handling, and parameter storage.

Key Features and Peripherals

The defining characteristic of the ATTINY1617 is its impressive suite of integrated peripherals, which reduces the need for external components and simplifies design complexity.

Advanced Analog Capabilities: It features a 14-channel 10-bit ADC with oversampling, enabling accurate analog sensor measurements. Crucially, it also includes a 10-bit Digital-to-Analog Converter (DAC), a peripheral not commonly found in MCUs of this class, allowing for direct generation of analog voltages.

Versatile Timers and Communication: The device is equipped with multiple 16-bit timers/counters (TCA, TCB, and RTC) for precise waveform generation, motor control, and time-keeping. For connectivity, it offers multiple Serial Communication Interfaces (SPI, I2C, and UART), facilitating easy communication with sensors, displays, and other peripherals.

Core Independent Peripherals (CIPs): A standout feature is its array of CIPs, such as the Configurable Custom Logic (CCL). CIPs allow peripherals to interact and perform tasks autonomously without constant CPU intervention, dramatically reducing power consumption and freeing up the core for other operations.

Robust Safety and Debugging: The MCU includes a suite of safety features like CRC/SCAN, Window Watchdog Timer, and Power-On Reset. Furthermore, it supports debugging through the UPDI (Unified Program and Debug Interface), a single-wire interface that simplifies the development and programming process.

Package and Nomenclature (MZT-VAO)

The suffix "MZT-VAO" in the part number is critical. "MZT" denotes the specific package: a 20-pin VQFN (Very Thin Quad Flat No-Lead) package with a 3x3mm footprint. This ultra-compact package is designed for high-density PCB layouts. "VAO" is a vendor-specific code that often relates to tape and reel packaging for high-volume, automated manufacturing.

Target Applications

The combination of small size, low power, and high integration makes the ATTINY1617-MZT-VAO ideal for a diverse range of applications, including:

Internet of Things (IoT) Sensor Nodes

Consumer Electronics (remote controls, toys, wearables)

Industrial Control Systems (sensors, actuators, motor control)

Automotive (interior lighting, buttons, and control panels)

Household Appliances and smart gadgets

ICGOODFIND

The Microchip ATTINY1617-MZT-VAO stands as a testament to the evolution of 8-bit MCUs, offering a powerful feature set that rivals many 16-bit counterparts. Its blend of processing power, advanced analog integration (including a DAC), Core Independent Peripherals, and an ultra-small VQFN package makes it an exceptionally versatile and efficient solution for modern embedded designers aiming to create innovative and compact products.

Keywords: ATTINY1617-MZT-VAO, AVR Microcontroller, Core Independent Peripherals (CIP), VQFN Package, Low-Power Design

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